| Essentials |
|
| Product Collection |
Intel® Server D50TNP Family |
| Code Name |
Products formerly Tennessee Pass |
| Marketing Status |
Launched |
| Launch Date |
Q3'21 |
| Expected Discontinuance |
2023 |
| EOL Announce |
Friday | May 5 | 2023 |
| Last Order |
Friday | June 30 | 2023 |
| Limited 3-year Warranty |
Yes |
| Extended Warranty Available for Purchase (Select Countries) |
Yes |
| Additional Extended Warranty Details |
Dual Processor Board Extended Warranty |
| Compatible Product Series |
3rd Generation Intel® Xeon® Scalable Processors |
| Board Form Factor |
8.33” x 21.5” |
| Chassis Form Factor |
2U Rack |
| Socket |
Socket-P4 |
| Integrated BMC with IPMI |
IPMI 2.0 & Redfish |
| Rack-Friendly Board |
Yes |
| TDP |
205 W |
| Included Items |
(1) Intel® Server Board D50TNP1SB (1) 2U half-width module tray – iPN K74857 (1) 1U storage module air duct right – iPN K88592 (1) 1U storage module air duct left – iPN K88590 (2) 1U riser bracket to support TNP1URISER – iPN K25206 (2) M.2 heat sink assembly TNPM2HS (1) 1U Air-Cooled front Heat Sink TNP1UHSF (1) 1U Air-Cooled Rear Heat Sink TNP1UHSB (2) Processor clip | for 3rd Gen Intel® Xeon® Scalable processor family – iPN J98484 (1) Storage Compute Module Docking Board TNPSTDCKBRD (2) OCuLink cable 520 mm – iPN K73563 (2) OCuLink cable 125 mm – iPN K73567 (2) OCuLink cable 145 mm – iPN K73568 (2) OCuLink cable 140 mm – iPN K73570 (1 each) OCuLink connector covers for J25 | J26 | J29 | and J30 – iPN K74231 (1 each) OCuLink connector covers for J27 and J28 – iPN K74230 |
| Board Chipset |
Intel® C621A Chipset |
| Target Market |
High Performance Computing |
| |
|
| Supplemental Information |
|
| Embedded Options Available |
No |
| Description |
A 2U high-density Storage module integrated with the Intel® Server Board D50TNP1SB intended for dense and fast storage solutions | supports up to 16 EDSFF E1.L NVMe* SSDs. |
| |
|
| Memory Specifications |
|
| Max Memory Size (dependent on memory type) |
6 TB |
| Memory Types |
-DDR4 (RDIMM) -3DS-RDIMM -Load Reduced DDR4 (LRDIMM) -3DS-LRDIMM -Intel® Optane™ persistent memory 200 series modules |
| Max # of Memory Channels |
16 |
| Max Memory Bandwidth |
204.8 GB/s |
| # of Memory Slots |
24 |
| ECC Memory Supported ‡ |
Yes |
| Intel® Optane™ Persistent Memory Supported |
Yes |
| |
|
| Processor Graphics |
|
| Integrated Graphics ‡ |
Yes |
| Graphics Output |
VGA |
| |
|
| Expansion Options |
|
| PCI Express Revision |
4 |
| Max # of PCI Express Lanes |
56 |
| PCIe OCuLink Connectors (NVMe support) |
8 |
| Riser Slot 1: Total # of Lanes |
32 |
| Riser Slot 2: Total # of Lanes |
24 |
| |
|
| I/O Specifications |
|
| # of USB Ports |
3 |
| USB Configuration |
• One USB 3.0 port • Two USB 3.0 ports (dual-stack) |
| USB Revision |
3 |
| Total # of SATA Ports |
2 |
| Max # of UPI Links |
3 |
| RAID Configuration |
0/1/5 |
| # of Serial Ports |
1 |
| Integrated LAN |
1 |
| |
|
| Package Specifications |
|
| Max CPU Configuration |
2 |
| |
|
| Advanced Technologies |
|
| Advanced System Management key |
Yes |
| Intel® Optane™ Memory Supported ‡ |
Yes |
| Intel® Virtualization Technology for Directed I/O (VT-d) ‡ |
Yes |
| Intel® Node Manager |
Yes |
| Intel® Advanced Management Technology |
Yes |
| TPM Version |
2 |
| |
|
| Security & Reliability |
|
| Intel® AES New Instructions |
Yes |
| Intel® Trusted Execution Technology ‡ |
Yes |
